2021 World Semiconductor Conference and Nanjing International Semiconductor Expo

The National Fourteenth Five-Year Plan clarifies the vigorous development of third-generation semiconductors. The third-generation semiconductor industry has received strong support from the national level and entered the fast lane of development. At the same time, the third-generation semiconductors can meet the needs of many fields in the new infrastructure. In 2021, the country, provinces, and cities will exert a strong momentum for new infrastructure, once again pushing the third-generation semiconductor to the forefront.

Driven by the market and national policies, on June 11, 2021, the 2021 World Semiconductor Conference and Nanjing International Semiconductor Expo-the second international third-generation semiconductor industry development summit forum was successfully held in Nanjing International Expo Center. The first 6-inch compound semiconductor company in China-Chengdu Hiway Huaxin Technology Co., Ltd. was invited to attend.

This summit forum was co-hosted by the Third Generation Semiconductor Industry Technology Innovation Strategic Alliance (CASA) and CCID Consulting Co., Ltd. Many heavy guests from the industry were present, the venue was full, the forum continued to be popular, and the discussion and exchange atmosphere was strong.

At the forum, Dr. Liming, the deputy general manager of Chengdu Hiway Huaxin Technology Co., Ltd., gave a speech entitled "The Application of Third-Generation Semiconductors in New Infrastructure", introducing the third-generation semiconductors in the new infrastructure from the technical and market level. It analyzes the application scenarios and technical indicators of SiC and GaN chips in the fields of 5G base stations, new energy electronics, big data centers, etc., and introduces the industrial layout, process capabilities, and industries of Hiway Huaxin in the third generation of compound semiconductors. At the same time, it expresses the development concept of Haiwei Huaxin's collaborative innovation and win-win cooperation with the industry.

Dr. Liming pointed out that with the overall advancement of the new infrastructure industry, core chips have gradually shifted from traditional Si to third-generation semiconductor (GaN, SiC) chips. Hiway Huaxin is positioned in the field of compound semiconductor chip manufacturing and is in the entire industry chain. The core link is the link between chip design companies and complete machine suppliers. According to the research report of Yole, a well-known foreign research institution, Hitech Huaxin occupies a place in the global compound semiconductor industry and is a global manufacturer of 5G communication radio frequency chips.

Since its establishment in 2011, Hiway Huaxin has continued its efforts in compound semiconductor chip manufacturing after years of hard work: In 2016, GaAs chips were mass-produced; in 2017, Hiway Huaxin produced the first 6-inch SiC-based GaN radio frequency in China. Wafers; in 2019, a variety of products including Si-based GaN power chips will be mass-produced; in 2020, 5G base station GaN radio frequency chips will be released globally, and SiC power electronic chips will enter small batch trial production, continuously promoting the third generation of domestic semiconductor chips Industry development.

"With an open production line, mature and reliable PDK and six-inch wafer process and other leading advantages, Hiway Huaxin has become a scarce resource under the current tide of chip shortage," Dr. Liming added.

From Dr. Limings introduction, it can be seen that Hi-Wei Huaxin has nearly a number of compound semiconductor-related patents and has excellent competitiveness in the core technology of third-generation semiconductors. It can build 5G base stations, new energy charging piles, and big data centers. Provide "core" support in areas such as power supply.

At this forum, Dr. Liming also focused on the industry to introduce Huawei Huaxin's hot products in the direction of power amplifier chips for 5G base stations and power chips for new energy charging piles, which have received unanimous praise and focus on the industry.

After the report, many participants and Dr. Liming conducted in-depth exchanges and discussions on the third-generation semiconductor technology, market, capital, and application prospects. The guests at the meeting expressed affirmation of Hiweihuaxin's current manufacturing capabilities and future R&D routes, and strongly expressed their intention and expectation for cooperation with Hiweihuaxin in the SiC and GaN chip industries.